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XB3-C-G4-UT-102
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Digi XBee 3 Global LTE Cat 4, 3G / 2G, GNSS, Verizon SIM
Related to:
Digi XBee 3 Global LTE Cat 4
Coming soon
Part Number:
XB3-C-G4-UT-102
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Digi XBee 3 Global LTE Cat 4, 3G / 2G, GNSS, Verizon SIM
Hardware
Cellular chipset: Thales PLS83-W
Form factor (connector footprint):
Digi XBee®
20-pin through-hole
Antenna options: 2 U.FL: cellular diversity, 1 U.FL: GNSS; embedded Bluetooth® antenna
Dimensions: 30.48 mm x 43.18 mm (1.2 in x 1.7 in)
Operating temperature: −40 ºC to 80 ºC (−40 ºF to 176 ºF)
SIM size: 4FF Nano
Interface and I/O
Data interface: UART, SPI, USB
Operating modes: Transparent and API over serial, PPP over USB
Security:
Digi TrustFence®
security with secure boot and protected JTAG
Configuration tools:
Digi XBee Studio
(local),
Digi Remote Manager®
(OTA)
Embedded programmability: MicroPython with 8 MB flash / 64 kB RAM
I/O: 4 ADC lines (10-bit), 13 digital I/O, I2C
Bluetooth: Bluetooth Low Energy (BLE)
Cellular characteristics
Transmit power (4G LTE/3G/2G): 23 dBm / 23.5 dBm / 30-33 dBm
Receive sensitivity (4G LTE/3G/2G): 103 dBm / 110 dBm / 108 dBm
Supported bands:
LTE: B1, B2, B3, B4, B5, B7, B8, B12, B13, B18, B19, B20, B26, B28, B38, B40, B41, B66
3G: B1, B2, B3, B4, B5, B6, B8, B19
2G: 850, 900, 1800 and 1850 MHz
Downlink / uplink speeds:
LTE: 150 Mbps downlink, 50 Mbps uplink
3G: 14..4 Mbps downlink, 5.76 Mbps uplink
2G: 237 kbps downlink and uplink
Duplex mode: Full-duplex
Power requirements (at 3.3 VDC input power)
Supply voltage: 2.8 to 5.5 V
Peak transmit current: 1050 mA with Bluetooth disabled; 1090 mA with Bluetooth enabled
Avg transmit current: 890 mA
Avg receive current: 320 mA
Regulatory and carrier approvals
FCC (USA): MCQ-XB3C2 and QIPPLS83-W
ISED (Canada): 1846A-XB3C2 and 7830A-PLS83W
CE / RED (Europe): Complete
RCM (Australia / New Zealand): Pending
UKCA (United Kingdom): Complete
ANATEL (Brazil): Complete
NOM (Mexico): Pending
Japan: Pending
South Africa: Pending
Argentina: Pending
PTCRB, AT&T and Verizon: Complete
Warranty
1-year
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